What is Epoxy Resin Bisphenol A CAS 61788-97-4?

It is a general-purpose liquid epoxy resin based on bisphenol A diglycidyl ether, supplied as a viscous thermosetting prepolymer. The product is used in coatings, adhesives, casting, laminates, composites, and electrical insulation.

What is the difference between E-51 and E-44 epoxy resin?

E-51, equivalent to international 828 or 128 types, has a lower epoxide equivalent weight and lower viscosity, so it wets and impregnates more easily. E-44, equivalent to 6101 type, has higher viscosity and higher molecular weight, making it suitable for formulations that need more body or different mechanical properties.

Does bisphenol A epoxy resin cure by itself?

No. CAS 61788-97-4 is a prepolymer and remains uncured until mixed with a hardener. Polyamines and polyamides are common for room-temperature or moderate-temperature cure, while anhydrides are used for higher-temperature electrical and electronic systems.

Why is low hydrolyzable chlorine content important for electronic grade epoxy resin?

Residual hydrolyzable chlorine can harm electrical insulation and promote corrosion in electronic encapsulation. Low-chlorine grades reduce ionic contamination, improve long-term reliability, and are preferred for high-end coatings, potting, and electronic applications.

What are the main applications of Epoxy Resin Bisphenol A CAS 61788-97-4?

Typical applications include protective and anticorrosive coatings, structural adhesives, casting and potting compounds, fiber-reinforced composites, laminates, and electrical insulation. The grade is selected by EEW, viscosity, reactivity, and final cured-property requirements.

Epoxy Resin (Bisphenol A) CAS 61788-97-4

Epoxy Resin CAS 61788-97-4 is a versatile thermosetting polymer chemically defined as the reaction product of bisphenol A and epichlorohydrin, functioning primarily as a high-performance binder in coatings, adhesives, and composite materials. Commonly traded as Liquid Grade (E-51/828) or Solid Grade (E-12/1001) based on molecular weight, this clear viscous liquid (or solid flake) requires a curing agent (hardener) to crosslink into a rigid, chemically resistant plastic. Methyltetrahydrophthalic Anhydride (MTHPA) is a related anhydride hardener where heat-cure chemistry is specified; ratio and cure conditions must be confirmed. It is extensively utilized in the production of industrial floor coatings, PCB potting compounds, and corrosion-resistant marine paints. We provide professional access to this material with competitive factory pricing and the ability to meet customized specifications (varying Epoxide Equivalent Weight - EEW) for various manufacturing requirements. Our commitment to technical transparency ensures that every shipment is accompanied by comprehensive MSDS, TDS, COA documentation to support your quality assurance protocols, and we maintain capacity for consistent bulk supply to facilitate large-scale industrial operations.

CAS: 61788-97-4
Synonyms: Bisphenol A diglycidyl ether polymer, DGEBPA resin, Phenol 4,4'-(1-methylethylidene)bis- polymer with (chloromethyl)oxirane, Epoxy resin E-51, Epoxy resin 828, Liquid epoxy resin
Molecular Formula: (C15H16O2·C3H5ClO)n
Grade: Industrial Grade, Electronic Grade (E-51 / E-44 type equivalents).
Package: 220kg Iron Drum or 1.15MT IBC Tank.

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Product Description

Our Liquid Epoxy Resin (CAS 61788-97-4) is a high-purity, general-purpose thermosetting polymer widely recognized for its superior mechanical properties and chemical resistance. It serves as the industry standard foundation for high-performance coatings, adhesives, and composite materials.

This resin is characterized by high reactivity, excellent adhesion to various substrates (metal, concrete, glass), and exceptional electrical insulation properties. It is designed to be cured with a wide variety of hardeners, including polyamines, polyamides, and anhydrides, allowing for versatile formulation capabilities tailored to specific environmental conditions.

Need a specific Epoxide Equivalent Weight (EEW) or Viscosity? 📧 Email: info@industrochem.com

We utilize advanced washing processes to ensure low hydrolyzable chlorine content, making our resin suitable for electronic encapsulation and high-end anti-corrosion applications.

1 Physicochemical Properties (Technical Data)

2 Applications

3 Quality Assurance (QA/QC)

4 Storage, Handling & Safety

Physicochemical Properties (Technical Data)

The following specifications reflect our Standard Liquid Grade (Equivalent to E-51 / 128), fully aligned with GB/T 13657 and international export standards.

Property	Specification
Appearance	Clear, viscous liquid
Epoxide Equivalent Weight (EEW)	184 – 194 g/eq
Viscosity (25°C)	11,000 – 14,000 mPa·s
Color (APHA/Gardner)	$\leq 1$
Hydrolyzable Chlorine	$\leq 0.10 %$
Inorganic Chlorine	$\leq 5 m g / k g$
Volatile Content	$\leq 0.20 %$
Specific Gravity (25°C)	1.16 g/cm³
Flash Point	$> 240^{\circ} C$
Solubility	Soluble in Toluene, Xylene, Acetone

Applications

Epoxy Resin is a critical material across multiple industrial sectors:

1. Coatings & Paints:

Flooring: The primary binder for self-leveling epoxy floors in industrial warehouses and cleanrooms due to its high compressive strength and dust-proofing capability.
Marine & Anti-Corrosion: Used in primers and topcoats for ships and steel structures, providing an impermeable barrier against saltwater and harsh chemicals.

2. Composites & Construction:

FRP: Acts as the matrix for fiber-reinforced plastics (fiberglass/carbon fiber) used in wind turbine blades, automotive parts, and pipes.
Civil Engineering: Used in grouting, crack injection repair, and bonding concrete segments.

3. Electronics (Electronic Grade):

Encapsulation: Used for potting printed circuit boards (PCBs) and electronic components to protect against moisture, thermal shock, and vibration.

4. Adhesives:

Formulates into high-strength structural adhesives (2-component glues) capable of bonding metals, ceramics, and rigid plastics.

Quality Assurance (QA/QC)

At Industrochem, consistency determines success. Our manufacturing process follows strict ISO 9001:2015 protocols.

Molecular Weight Control: We utilize GPC (Gel Permeation Chromatography) to monitor the molecular weight distribution, ensuring consistent curing kinetics and mechanical performance batch-to-batch.
EEW Verification: The Epoxide Equivalent Weight is tested via titration for every single batch. This is the most critical parameter for customers to calculate the precise ratio of hardener required.
Impurity Removal: Post-synthesis washing stages are strictly monitored to minimize ionic impurities (Cl-, Na+), which is crucial for preventing corrosion in electronic applications.

For an anhydride curing-agent option used with epoxy systems, see Methyltetrahydrophthalic Anhydride (MTHPA).

Storage, Handling & Safety

Storage Conditions:

Temperature: Store in a cool, dry place between 15°C and 40°C.
Crystallization Warning: Liquid epoxy resin may crystallize (turn milky or solid) if stored at low temperatures (<10°C) for extended periods.
- Solution: This is a reversible physical change. Heat the drum to 50-60°C and stir until the resin returns to a clear liquid state. It does not affect performance.
Shelf Life: 24 months in tightly sealed original containers.

Safety Precautions (HSE):

Sensitization: Epoxy resin can cause skin sensitization and allergic dermatitis upon prolonged contact.
PPE Recommendations:
- Skin: Wear chemical-resistant gloves (Nitrile or Butyl) and protective sleeves. Avoid direct skin contact.
- Eyes: Safety goggles with side shields are mandatory.
- Respiratory: Use organic vapor respirators if applying via spray or in poorly ventilated areas.
Spills: Absorb with sand or inert absorbent material. Do not wash into drains.

Source premium Liquid Epoxy Resin directly from the manufacturer.

Whether for heavy-duty industrial flooring or precision electronic potting, we provide the stability you need.

👉 Get a Quote: info@industrochem.com

FAQ - Technical & Supply Chain

Q:
What is Epoxy Resin Bisphenol A CAS 61788-97-4?

A: It is a general-purpose liquid epoxy resin based on bisphenol A diglycidyl ether, supplied as a viscous thermosetting prepolymer. The product is used in coatings, adhesives, casting, laminates, composites, and electrical insulation.
Q:
What is the difference between E-51 and E-44 epoxy resin?

A: E-51, equivalent to international 828 or 128 types, has a lower epoxide equivalent weight and lower viscosity, so it wets and impregnates more easily. E-44, equivalent to 6101 type, has higher viscosity and higher molecular weight, making it suitable for formulations that need more body or different mechanical properties.
Q:
Does bisphenol A epoxy resin cure by itself?

A: No. CAS 61788-97-4 is a prepolymer and remains uncured until mixed with a hardener. Polyamines and polyamides are common for room-temperature or moderate-temperature cure, while anhydrides are used for higher-temperature electrical and electronic systems.
Q:
Why is low hydrolyzable chlorine content important for electronic grade epoxy resin?

A: Residual hydrolyzable chlorine can harm electrical insulation and promote corrosion in electronic encapsulation. Low-chlorine grades reduce ionic contamination, improve long-term reliability, and are preferred for high-end coatings, potting, and electronic applications.
Q:
What are the main applications of Epoxy Resin Bisphenol A CAS 61788-97-4?

A: Typical applications include protective and anticorrosive coatings, structural adhesives, casting and potting compounds, fiber-reinforced composites, laminates, and electrical insulation. The grade is selected by EEW, viscosity, reactivity, and final cured-property requirements.

Ordering & Documentation

Key information for document requests, quotations, and supply planning.

Documents

COA, TDS, SDS/MSDS and packing details are available on request.

Quotation

Send the CAS number, grade, quantity, packing preference and destination.

Sample & Supply

Support is available for samples, trial orders, bulk and repeat supply.

Storage & Shipping

Product-specific conditions are confirmed before order.

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