• Dicyandiamide CAS 461-58-5
  • Dicyandiamide CAS 461-58-5

Dicyandiamide CAS 461-58-5

Dicyandiamide, also known as cyanoguanidine and DCDA, is a nitrogen-containing crystalline compound used as a latent curing agent and chemical intermediate in epoxy resin curing systems. It reacts with epoxy functional groups under elevated temperature conditions, enabling delayed crosslinking behavior and controlled reaction progression during industrial resin processing, and is typically incorporated in solid or powder-based formulations (CAS 461-58-5). For industrial supply requirements, the material is provided with competitive factory pricing, customized specifications, complete documentation including MSDS, TDS, COA, and options for bulk supply.

  • CAS: 461-58-5
  • Synonyms: Dicyandiamide, Cyanoguanidine, Carbamidine dicyanide, DCDA
  • Einecs: 207-312-8
  • Molecular Formula: C2H4N4
  • Grade: Industrial grade 99%
  • Package: 200kg iron drum or 50kg plastic drum packaging
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Product Description

Product Name:Dicyamide

Other names: cyanoamine dicyanodiammine cyanoguanidine melamine melamine

Chemical formula:C2H5N4

Molecular weight: 84.08

Appearance:White crystalline powder

Dicyanamine 1 1

CAS:461-58-5

EINECS:207-312-8

Boiling point: 252 °C (decomposition) °C

Water solubility: 41.3 g/l

Density: 1.400 g/cm³

Appearance: white crystalline powder

Molar mass: 84.08 g·mol−1

Melting point: 209.5 °C°C

Uses: used as fertilizer, nitrocellulose stabilizer, rubber vulcanization accelerator, also used to make guanidine salts, meamine, barbiteric acid, etc., and is also an intermediate in synthetic medicine, pesticides and dyes.

FAQ - Technical & Supply Chain

  • Q:

    Are dicyandiamide and DCDA the same substance under the same CAS number?

    A: Yes. Dicyandiamide and DCDA are different names for the same compound and correspond to a single CAS identity.
  • Q:

    Is dicyandiamide intended for industrial epoxy systems rather than laboratory-only use?

    A: Dicyandiamide is commonly applied in industrial epoxy resin curing formulations, where it functions as a latent curing agent during manufacturing and processing operations.
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